ACB Printed Circuit Boards for Military and Avionic Applications | APC Technology Group
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ACB Space Qualified Printed Circuit Boards

Quick turnaround PCBs with technical support and reliability testing

APC’s High-Reliability components team can support your projects with Advanced Circuit Board’s range of printed circuit boards. Designed for use in the most demanding environments, ACB’s solutions comprise the latest manufacturing technologies and high-performance materials to provide mission-critical success.

Reliably tested to ensure the highest quality

100% Electrical probe-tested, COC, Cross-section and Impedance
 Measurements, reliability tests and lifetime simulations
FAI-reporting, full IPC class 3 inspection
Group 6 and IST testing on request

Materials

FR4, FR4 High Tg, FR4 Low CTE, polyimide-flex, polyimide-glass, CIC
High-performance, high-speed, and halogen-free materials
Copper and aluminium heatsinks

Specialist Technologies

Laser direct imaging, led direct imaging, laser drilling, automatic optical inspection
Lead and halogen-free PCB's, resin plugged μvias, thermal and CTE management
Cu filled and stacked microvia, multiple pressings

ACB Design Capabilities

• Rigid, flex-rigid and flex multilayer printed circuit boards

• Analog, digital, high-speed digital and RF

• European manufacturer with production plants in Belgium and France

• Focus on high-tech markets for small series and prototypes in quick turnaround

• NADCAP, ESA and AS/EN9100 certified

ACB Capability Examples

HDI 25 HDI: 2.5 + 12 + 2.5 with buried μvias in 0.1mm coresHDI 25 HDI: 2.5 + 12 + 2.5 with buried μvias in 0.1mm cores

5 layers μvia with 3 layers
Cu filled and stacked

Back drillingBack drilling

Back drilling

cic pcb circuit boardcic pcb circuit board

CTE Control: 4 layers CU
Invar CU in blind runs

hdi pcbhdi pcb

18 layer HDI: 3 + 12 + 3

5 layers μvia with 3 layers Cu filled and stacked5 layers μvia with 3 layers Cu filled and stacked

4 layers Cu filled and stacked μvia

18 layer with 4 levels stacked Cu filled 75 μm μvia18 layer with 4 levels stacked Cu filled 75 μm μvia

18 layer with 4 levels stacked
Cu filled 75 μm μvia

2nd generation Cu filled μvia technology2nd generation Cu filled μvia technology

20 layer Flex Rigid with 18 flex layers

HDI with thermal management 2 x 210 μm CuHDI with thermal management 2 x 210 μm Cu

HDI with thermal management 2 x 210 μm Cu

Get in touch with one of our experts


When you need assistance with the design of your high-end PCBs or you would like to double-check the manufacturability of your design, speak with a member of our high-reliability team. ACB is able to supply quick-turn circuit boards with some of the fastest lead times in the industry. Ask our team today.

 

0330 313 3220

[email protected]

ACB is qualified by several European Space key players and by ESA (European Space Agency).

ACB Design Capabilities

• Rigid, flex-rigid and flex multilayer printed circuit boards

• Analog, digital, high-speed digital and RF

• European manufacturer with production plants in Belgium and France

• Focus on high-tech markets for small series and prototypes in quick turnaround

• NADCAP, ESA and AS/EN9100 certified