3DCM830
3DCM830
3D Plus
1.3Mpx SWIR Space Camera Head (1280×1024, InGaAs sensor, 400–1700nm)
The CASPEX SWIR Space Camera Head embeds all necessary components to operate its 1.3Mpx InGaAs SWIR image sensor and high-performance FPGA-based architecture in a highly constrained space environment, including all DC-DC converters, processing and storage memories in a reduced volume of 40x40x45mm3.
This camera module offers a configurable electrical interface through a 77-pins PGA matrix, including 22 LVDS pairs, a JTAG interface for FPGA configuration, and a 5V power supply interface, and compatible to the 12Mpx Space Camera Head.
The CASPEX SWIR Space Camera Head design provides to the users a dedicated optical, mechanical and thermal interface for an optimal and easy integration in space optical instruments as well as a second thermal interface dedicated to the processing architecture, allowing an efficient separation between the sensing part and the processing part of the camera head.
The CASPEX SWIR Space Camera head is a generic product, suitable for multiple high performance space applications requiring SWIR sensitivity such as scientific imaging (spectrometry, planetology), earth observation, navigation and rendezvous applications in constrained light environment.
Key Features:
- All-in-one space-qualified high-resolution and high-performance camera head:
- 1280×1024 Global Shutter InGaAs + CMOS image sensor
- Up to 134 frame/s in acquisition mode at sensor interface
- High-performance FPGA architecture with integrated memories
- Read Noise: 240 e-, Dark current: 28 ke-/s at 25°C
- FWC: 170k e
- Operating temperature range: -55 °C to +70 °C
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Enhanced radiation performance:
- TID > 40 krad (SI)
- SALT LET > 60 MeV.cm²/mg
Contact a member of our team to download the datasheet.
Click below to request a quote for this item. Or for product advice, stock and lead time enquiries call our team on 0330 313 3220.
| Attribute | Value |
|---|---|
| Data Sheet | Click here to view |
