3DFN064G08VB1388

3DFN064G08VB1388

3DFN064G08VB1388

3D Plus

3.3V, 64Gbit NAND Flash organised as 2x 512Mb x8, based on 32Gb x2

The 3DFN64G08VB1388 is a 3.0V single power high density non-volatile NAND flash memory based on 2 two 32Gb basic components. It is organised as 2x 512Mx8bit based on 4096 blocks of 128 pages of 8192+448 bytes offering a total of 1Gx8 bit with spare 56Mx8 capacity. It is organised in 2 ranks with separate chip enable (CE#) and Ready/Busy (R/B#) controls. This organisation is fully compliant with ONFI 2.2 standard.

The on-chip Program/Erase controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. The overall operation can be monitored through the operation status bytes. Write-intensive systems can take advantage of the module extended reliability by providingECC with real time mapping out algorithm.

Thanks to the high density patented technology and the cold manufacturing process, the 3DFN64G08VB1388 does integrate NAND Flash in a small form factor package without compromising electrical or thermal performance. The 3DFN64G08VB1388 is packaged in a 52 pads LGA and available in commercial, industrial and military temperature range.

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More Information
Attribute Value
Features
  • Open NAND Flash interface 2.2 Compliant
  • Single Level Cell (SLC) technology
  • Device width: x8
  • Operating voltage range Vcc: 2.7V – 3.6V
  • Page Read Operation
    • Random access: 35µs (Max)
    • Serial access: 20ns (Min)
  • Fast Write cycle time
    • Program time
    • Block Erase
  • Command/address/data Multiplexed I/O port
  • Hardware data protection
  • Reliable NAND technology
    • Endurance: 60,000 program/erase cycles
    • Data retention: 10 years
Product Type NAND FLASH
Configuration 64Gb
Package LGA 52
Temperature Range
  • 0°C to +70°C
  • -40°C to +85°C
  • -55°C to +125°C
Power Supply 3V
More Information
Attribute Value
Data Sheet Click here to view

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