SOM-DB8900

SOM-DB8900

SOM-DB8900

Advantech

COM-HPC Server Carrier for Size D and Size E Modules

COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE.
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Key Features
  • PICMG COM-HPC Server pinout
  • COM-HPC Size D and E compatible
  • Rich extension: 1 PCIe x16, 2 PCIe x8, 5 PCIe x4
  • Integrated BMC supports VGA, Dedicated NIC for IPMI, iKVM
  • 10/25 Gigabit Ethernet support by OCP mezzanine card
  • Visible Debug Utility: BIOS 80 Port and Power State
Sub Category Server
Supply Voltage Vin: 12V ±5%
VSB: 5 ±5%
USB 3.2 Gen2 (type A) 2.0000
USB 2.0 2 (Type A Connector)
COM Port 2 (1x D-SUB 9P, 1x Box Header)
Graphics Controller AST2500 Integrated 2D Graphics Controller
PCI Express x16 1
PCI Express x8 2
PCI Express x4 5
eSPI 1
M.2 B Key 1
M.2 E Key 1
M.2 M Key 2
SMBus 1
I²C Bus 2 (1x 1.8v, 1x 3.3v)
Gigabit Ethernet 1 port 1000Base-T (RJ-45) supports 10/100/1000 Mbps from AST2500, supports IPMI
1 port 1000Base-T (RJ-45) supports 10/100/1000 Mbps from Module side
Fast Ethernet Up to 8 Ports, support 10G/25G by OCP mezzanine card
SATA3.0 2 (Type B Connector)
USB 4.0 2
Boot SPI 1 (SPI Socket)
GP SPI 1 (6x2P Pin Header)
GPIO 12 (12P Pin Header)
Fan 2 (1x 4P Smart Fan Header from Module side, 1x 3P System Fan Header)
Port 80 1
Power Type ATX: Vin, VSB; AT: Vin
Graphics Frequency 266MHz
Graphics Memory 1GB @ DDR4-1600
Storage Temperature -40 ~ 85 °C (-40 ~ 185 °F)
Operating Temperature 0 ~ 60 °C (32 ~ 140 °F)
Product Type COM-HPC
Humidity Operating: 40°C @ 95% relative humidity, non-condensing
Storage: 60°C @ 95% relative humidity, non-condensing
Dimensions 366 x 330 mm
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Data Sheet Click here to view

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