SOM-DB8900
SOM-DB8900
Advantech
COM-HPC Server Carrier for Size D and Size E Modules
COM-HPC Server has D/E two sizes with IPMB remote control ability and next generation high-speed I/O like PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25GbE.
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Attribute | Value |
---|---|
Key Features |
|
Sub Category | Server |
Supply Voltage |
Vin: 12V ±5%
VSB: 5 ±5% |
USB 3.2 Gen2 (type A) | 2.0000 |
USB 2.0 | 2 (Type A Connector) |
COM Port | 2 (1x D-SUB 9P, 1x Box Header) |
Graphics Controller | AST2500 Integrated 2D Graphics Controller |
PCI Express x16 | 1 |
PCI Express x8 | 2 |
PCI Express x4 | 5 |
eSPI | 1 |
M.2 B Key | 1 |
M.2 E Key | 1 |
M.2 M Key | 2 |
SMBus | 1 |
I²C Bus | 2 (1x 1.8v, 1x 3.3v) |
Gigabit Ethernet |
1 port 1000Base-T (RJ-45) supports 10/100/1000 Mbps from AST2500, supports IPMI
1 port 1000Base-T (RJ-45) supports 10/100/1000 Mbps from Module side |
Fast Ethernet | Up to 8 Ports, support 10G/25G by OCP mezzanine card |
SATA3.0 | 2 (Type B Connector) |
USB 4.0 | 2 |
Boot SPI | 1 (SPI Socket) |
GP SPI | 1 (6x2P Pin Header) |
GPIO | 12 (12P Pin Header) |
Fan | 2 (1x 4P Smart Fan Header from Module side, 1x 3P System Fan Header) |
Port 80 | 1 |
Power Type | ATX: Vin, VSB; AT: Vin |
Graphics Frequency | 266MHz |
Graphics Memory | 1GB @ DDR4-1600 |
Storage Temperature | -40 ~ 85 °C (-40 ~ 185 °F) |
Operating Temperature | 0 ~ 60 °C (32 ~ 140 °F) |
Product Type | COM-HPC |
Humidity |
Operating: 40°C @ 95% relative humidity, non-condensing
Storage: 60°C @ 95% relative humidity, non-condensing |
Dimensions | 366 x 330 mm |
Attribute | Value |
---|---|
Data Sheet | Click here to view |