3D Plus award APC Technology Group Best Sales Growth Award for 2022
APC's High-Reliability team recognised by 3D Plus for outstanding growth in the space industry over the last 12 months.
APC's Richard Hough and Phil Lancaster recently attended the 3D Plus Worldwide Annual Meeting in Paris - bringing together partners from across the globe to discuss the application of 3D Plus products. Also addressed at the event were the technical developments currently being worked on by 3D Plus engineers, which will secure their position as a leading manufacturer of advanced high-density 3D microelectronics.
An important part of the annual meeting was to recognise the achievements of sales partners around the world. APC Technology Group were presented with the award for Best Sales Growth in 2022, which acknowledged the work the team have been doing with customers in the UK space market over the last 12 months. This includes successfully coordinating the design-in of 3DPlus parts with multiple customers in the UK working on space projects.
APC take part in the 3D Plus Worldwide Annual Meeting 2023
In addition to the full DDR4 ecosystem of memories, termination regulators and radiation-tolerant memory controllers available from 3D Plus for space projects, APC's team have been working with customers in the defence industry to ensure mission-critical applications benefit from miniaturised and rugged microelectronics. This includes solutions for flight control, navigation and digital signal processing (amongst others) and utilises camera products, FPGA and support memory, mass memory and associated peripherals also available from 3D Plus.
APC continue to work with both space and defence customers in the UK to supply 3D Plus solutions across a wide range of applications, from large equipment to mobile electronics.
To find out more about 3D Plus and its range of products, speak with a member of our high-reliability components team.
Best Sales Growth 2022
Awarded to APC Technology Group
3D PLUS is a world-leading supplier of advanced high density 3D microelectronic products, bare die and wafer-level stacking technology. 3D PLUS's products and solutions are used in high technology industries for industrial, computer boards & embedded systems, defence & security, aircraft & avionics, medical & sciences and aerospace applications.