FUSIO RT Space FPGAs from 3D PLUS | APC Technology Group

3D PLUS celebrates its first space flight heritage for its FUSIO RT FPGAs

The Chinese Chang'e 6 space mission, launched on May 3rd 2024, marks a significant milestone for the space components company and the FUSIO RT line.

This mission represents the first space flight heritage for the 3D PLUS FUSIO RT family, which integrates the NG-MEDIUM FPGA from NanoXplore. The development of the NG-MEDIUM component was supported by CNES, the European Space Agency (ESA) and the European Union.

This achievement is a testament to the hard work and dedication of all European companies and institutions involved in creating and making these new European space FPGAs available. 3D PLUS is proud to be at the forefront of this groundbreaking mission and celebrate this remarkable achievement.

The FUSIO RT component and other 3D PLUS products such as RIMC SDRAM and POL Converters are on board the Chang’e 6 spacecraft in the French DORN instrument. DORN, developed by IRAP, looks to measure the radioactive gases emitted by the lunar soil in the Dark Side of the Moon. The selection of these components is a testament and proof of the reliability and performance of 3D PLUS' space-qualified components and their capability to perform in challenging environments.

3D PLUS FUSIO RT Computer Core3D PLUS FUSIO RT Computer Core

FUSIO RT Computer Core

The FUSIO RT line from 3D PLUS provides a reprogrammable Rad Hard By Design (RHBD) SRAM-based FPGA with high reliability embedded memories: a 128 Mbit TMR configuration memory, in addition to optional computing and data storage memories, all integrated in one single miniaturised package.

The FUSIO RT products are ideal for system applications requiring performance, density and high reliability such as telecommunication satellites or experimental instruments.

Leading-edge European reprogrammable FPGA

  • 263 users I/Os
  • 800 Mbps I/O support
  • 550k ASIC gates equivalent to 4 400 000 system gates

Modular and upgradable computer core

  • 4 options all with the same footprint
  • High level of miniaturization: 483 balls BGA, (32 x 32) mm² area

Enhanced radiation performance

  • TID > 40 krad (Si)
  • SEL LET > 60 MeV.cm²/mg

Furthermore, the Chang’e 6 probe is as well equipped with cutting-edge technology provided by 3D PLUS. In addition to FUSIO RT, the space probe features essential components including EEPROM, NAND FLASH, SRAM, and NOR FLASH memories. These serve the crucial purpose of data storage and processing to ensure perfect mission execution. This milestone for FUSIO RT demonstrates the dedication and expertise of all involved at 3D PLUS, setting a new standard for space components.

Working closely in the UK and Ireland alongside 3D PLUS, APC's own high-reliability electronic components team is committed to helping the UK space industry find innovative solutions that push the boundaries of what is possible in space exploration and satellite technology. In addition to space-qualified memory and power solutions, APC can also advise on ESA-approved Printed Circuit Boards (PCBs), Arm Cortex microcontrollers and a wide range of complementary technologies and solutions suitable for performing in the harsh environments of space.

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Ask a member of our team about our complete portfolio of space technology solutions - from supporting ground station systems and applications to electronic components for NewSpace and space flight missions. Start a technical conversation with our team today.

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