3D PLUS introduces new SWIR camera head for space applications
3D PLUS expands its space camera head family by offering a high-density, high-performance 1.31 Mpixels SWIR Camera Head for space applications.
3D PLUS' proven stacking technology and experience with electronic modules and camera head manufacturing means the 3DCM830 SWIR Space Camera Head embeds a SWIR InGaAs image sensor with a high performance FPGA-based electronic architecture and associated memories. This, in turn, allows for efficient operating of the sensor as well as integration of image processing and formatting close to the image sensor.
Applications
The 3DCM830 SWIR Space Camera Head is suitable for many scientific applications:
- Extracting information in soils present in the near-infrared wavelengths (mineralogy)
- Analysis and observation of the Earth’s atmosphere by integration into spectrometer-type instruments (e.g. measurement of gas emissions due to human activity)
- Navigation and surveillance applications in difficult observation conditions (such as during an eclipse for example)
Radiation Data
- TID > 40 krads(Si)
- SEL LET > 60 MeV.cm²/mg
Availability of the new camera head
- Engineering models: Q3/22
- Flight models: Q1/23
In addition to the new camera head, 3D PLUS also released an update on its involvement with NASA's Mars Perseverance roverOne. Just over a year ago, the NASA-developed Perseverance rover unveiled the first images captured by the SuperCam instrument and CMOS Camera of 3D PLUS.
Since the rover's landing and deployment, it has been surveying Mars in search of traces of past life by studying the soil and its rocks. The rover also collects many samples that will be brought back to Earth by the ESA, MSR-ERO mission. These are the first and last images captured by the 3D PLUS CMOS camera.
First SuperCam images
Rocks captured on Sol 280
Image credits: NASA/JPL-Caltech/LANL/CNES/IRAP
Calibration target
Image credits: NASA/JPL-Caltech/LANL/CNES/IRAP
Latest SuperCam images
Rocks captured on Sol 280
Image credits:
NASA/JPL-Caltech/LANL/CNES/IRAP
SuperCam Views «Cine»
Image credits:
NASA/JPL-Caltech/LANL/CNES/IRAP
Artuby
Image credits:
NASA/JPL-Caltech/LANL/CNES/IRAP
3D PLUS is a world-leading supplier of advanced high density 3D microelectronic products, bare die and wafer-level stacking technology. 3D PLUS's products and solutions are used in high technology industries for industrial, computer boards, embedded systems, defence, security, aircraft, avionics, medical, sciences and aerospace applications.