Marki Microwave release new high frequency, ultra-small form factor chip scale packaging platform

Chip Scale Packaging Technology from Marki Microwave

Marki Microwave's patent pending chip scale packaging (CSP) platform provides superior performance in an ultra-compact form, enabling high frequency operation, improved electrical performance, and low unit-to-unit variation while optimising SWaP-C.

Marki Microwave’s unique approach to CSP technology for GaAs MMIC products can be leveraged across all of the company's product categories, enabling die-like size and performance with the ease of use of a surface mount product and standard surface mount assembly processes.

Christopher Marki, CEO of Marki Microwave

Marki’s Microwave’s new CSP technology enables high frequency operation, improved electrical performance, low unit-to-unit variation and consistency while optimizing size, weight, power and cost (SWaP-C). Moreover, the technology allows for extreme miniaturisation of the surface mount footprint while providing superior return loss in an ultra-compact form.

Unlike traditional packaging currently available on the market, Marki Microwave’s unique approach to CSP technology for GaAs MMIC products can be leveraged across all of Marki’s product categories, enabling die-like size and performance with the ease of use of a surface mount product.

New Product Highlight

Family of GaAs MMIC-Based equalisers and attenuators designed using CSP technology

Built for superior GaAs MMIC performance, the ATN10-0050CSP1, MEQ6-26CSP1, and MEQ10-45CSP1 are the newest additions to Marki Microwave’s portfolio of performance shattering products. Using CSP technology, their compact 1.5 x 1.5 mm design allows for extreme miniaturization of the surface mount footprint.